A Real-Time Infrared Scene Simulator in CMOS/SOI MEMS

Uncooled Infrared Radiation Focal Plane Array with Low Noise Pixel Driving Circuit

We have analyzed the dominant noise sources in the driving circuit of an uncooled infrared radiation focal plane array fabricated on a silicon-on-insulator (SOI) substrate by 0.35 μm CMOS technology and bulkmicromachining. We found no noise property of SOI-MOSFET inferior compared to those of NMOSs formed on SOI and bulk substrate, respectively. In addition, we reduced the total noise of the se...

SOI-CMOS-MEMS Electrothermal Micromirror Arrays

CMOS MEMS Fabrication Technologies and Devices

This paper reviews CMOS (complementary metal-oxide-semiconductor) MEMS (micro-electro-mechanical systems) fabrication technologies and enabled micro devices of various sensors and actuators. The technologies are classified based on the sequence of the fabrication of CMOS circuitry and MEMS elements, while SOI (silicon-on-insulator) CMOS MEMS are introduced separately. Introduction of associated...

Development of Cryogenic Readout Electronics for Far-Infrared Astronomical Focal Plane Array

We have been developing low power cryogenic readout electronics for space borne large format far-infrared image sensors. As the circuit elements, a fully-depleted-silicon-on-insulator (FD-SOI) CMOS process was adopted because they keep good static performance even at 4.2 K where where various anomalous behaviors are seen for other types of CMOS transistors. We have designed and fabricated sever...

Flip-chip Integrated Soi-cmos-mems Fabrication Technology

A fully-dry, flip-chip fabrication technology was developed for the integration of high fill factor, silicon-on-insulator (SOI) structures and CMOS-MEMS actuators. An SOI mirror array with a fill factor of 95% and radius of curvature >1.3 m was fabricated on CMOS-MEMS electrothermal actuators using this technology. The unloaded actuators achieved an optical scan range of >92o. Following flip-ch...